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Important News

Due to continued weakness in many segments of our industry, attendance for the Electronic Design Forum, was not what we expected and definitely not what was warranted for a networking event of the caliber that we envisioned. As a result, we will be postponing this year's event until 2006 - we are working toward events that are focused and hard hitting in a climate that, we feel, will be more economically conducive next year.

We would, once again, like to express our appreciation of the outstanding support and understanding we have received from our elite group of speakers and sponsors in making this difficult decision. We'll look forward to working with you all again as we develop our programs for 2005 and beyond.

Should you have any questions or comments with regard to this decision, don't hesitate to contact Mae Schaefer directly at 480-483-4473 or at mae.schaefer@reedbusiness.com or contact Leslie Hunziker directly at 707-528-2081 or lhunziker@reedbusiness.com.


The Electronic Design Forum provides information on the critical design elements of board and system designs, and the issues faced by the engineers designing them. The 2004 forum will focus on the new generation of high-speed interconnects from chip-to-chip to backplane solutions that will push the industry to 1 Gb, 10 Gb, and beyond.

Who should attend?
Design engineers and engineering management responsible for making design recommendations and decisions. The forum will also be useful to business managers and industry observers interested in learning about the new technology and the direction of the market.

Agenda Overview
Attendees will hear from technology leaders regarding developments in the next generation interconnects, suitable applications, and design considerations. The morning session will feature presentations on chip-to-chip interconnects and the afternoon session will focus on board and backplane interconnects. Both sessions will be followed by a panel of the speakers to directly address the issues of the attendees. At the end of the day, a panel of industry experts and observers will provide opinions on the information presented and perspectives on the challenges ahead.

The 2004 forum will also feature a keynote presentation. The keynote will be from Tom Lagatta, the Vice President of Enterprise Computing at Broadcom. The keynote will address the challenges the industry faces, the effect of new technology on future designs, and the direction of the industry.

An exposition will be held during lunch to allow attendees to learn more about he technologies and the companies involved in bringing them to market.

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