Keynote - Simplifying Network Connections: Eliminating Fabrics, Cables and Connections
Tom Lagatta, Group Vice President, Enterprise Computing, Broadcom

Chip Interconnect
Jim McGregor, Principal Analyst, In-Stat/MDR

PCI Express Standard: Extending PCI/X into Higher-end Systems Applications
presented by John Gudmundson, Marketing Manager, PLX Technology

HyperTransport: A 22.4 GB/s Chip-to-Chip Interconnect Technology
presented by Brian Holden, Chair, Technical Working Group, HyperTransport Consortium

Next-Generation System Prototyping with RapidIO
presented by Greg Shippen, System Architect, Freescale Semiconductor

High Speed Receive and Transmit Timing Generation
presented by Craig Hampel, Technical Director, Rambus

Backplane Interconnect
Jim McGregor, Principal Analyst, In-Stat/MDR

RapidFabric: Defining the Open Communications Fabric Standard
presented by James Montgomery, Field Application Engineer, Freescale Semiconductor

Advanced Switching Interconnect: Advantages & Applications
presented by Gary Lee, Director of Switch Fabric Marketing, Vitesse

Designing Embedded Systems with Multi-Gigabit serial I/O
presented by Abhijit Athavale, Marketing Manager, Xilinx Connectivity Solutions, Xilinx, Inc.

Fibre Channel Switching for Storage Array and Embedded Applications
presented by Michael McDonald, Senior Director, Broadcom Corporation

AdvancedTCA: Opportunities and Challenges for Packet Switch Fabrics
presented by Francois Le Maut, AMCC Fellow, AMCC

Breaking Down the Requirements of Backplane Interconnects
presented by Chris Bergen, Director of Systems, IDT, Inc.

Industry Pundits
presented by Maury Wright, Editor in Chief, EDN