|
Embedded
Processor Watch
MicroDesign
Resources --- May 16, 2000 #99
Senior
Editor: Tom Halfhill
In This
Issue:
- Lexra
Introduces LX4189 Core
- Massana
Teams With Lexra, Xemics
- Sneak
Preview: Embedded Processor Forum
- Patriot
Scientific Allies With ProSyst
Lexra
Introduces LX4189 Core
By Tom
R. Halfhill
Lexra
has introduced its fifth MIPS-like embedded-processor core,
the LX4189. It's very similar to the 32-bit LX4180 core rolled
out a year ago, except that it has an additional pipeline
stage to reach higher clock frequencies. Lexra says the LX4189
is better suited for next-generation 0.15-micron fabrication
processes.
While
the older LX4180 has a conventional MIPS five-stage pipeline,
the new LX4189 adds an extra stage at the front of the pipe
for accessing instruction memory. Besides shortening a critical
path and boosting clock speeds, the deeper pipeline also makes
it easier for ASIC designers to work with the synthesizable
model of the core, because clock timings are less critical.
According
to Lexra, the LX4189's worst-case clock frequency in a typical
0.15-micron process is 266MHz, and the core will occupy only
1mm^2 of die area. In comparison, MIPS Technologies specifies
a worst-case clock frequency of 200MHz and a nominal frequency
of 280MHz for a five-stage MIPS32 4K-series core in a larger
0.18-micron process, with the core occupying 1.4mm^2. (The
full version of this article is available online to Microprocessor
Report subscribers at http://www.MDRonline.com/mpr/h/2000/0508/141906.html).
Massana
Teams With Lexra, Xemics
By Tom
R. Halfhill
Silicon
Valley startup Massana has formed partnerships with two providers
of embedded-processor cores -- Lexra and Xemics -- to offer
integrated cores that combine CPUs with Massana's DSPs. The
new solutions span the range from very low power applications
to medium-performance applications and are available for licensing
now.
Massana's
deal with Lexra teams the FILU-200 soft DSP (see Embedded
Processor Watch #71, http://www.MDRonline.com/epw/issues/epw_71.html)
with Lexra's LX4180, a 32-bit soft CPU core that's largely
compatible with the MIPS instruction set (see Embedded
Processor Watch #30, http://www.MDRonline.com/epw/issues/epw_30.html).
The integrated solution is designed for system-on-a-chip (SOC)
devices aimed at broadband communications and networking applications.
The deal
with Xemics, a Swiss company, combines a lower-end version
of Massana's DSP (the FILU-50) with a proprietary 8-bit RISC
microcontroller core (CoolRISC). The FILU-50/CoolRISC is designed
for low-power embedded applications, such as motor-control
modules, sensors, Internet-enabled mobile appliances, medical
devices, and personal communicators. (The full version of
this article is available online to Microprocessor Report
subscribers at http://www.MDRonline.com/mpr/h/2000/0508/141905.html).
Sneak
Preview: Embedded Processor Forum
By Tom
R. Halfhill
More
than 20 companies will reveal new microprocessors, processor
cores, DSPs, and other technologies during the conference
sessions at Embedded Processor Forum, June 13-14. Here's a
sneak preview:
* High-Performance
Processors For Embedded Systems (Tuesday, June 13)
MIPS64
20K (MIPS Technologies): The first public disclosure of the
latest MIPS64-compatible processor core will describe the
64-bit superscalar R20Kc, which delivers 1,000 Dhrystone mips
and 2 GFLOPS. MIPS will also disclose its new MGB-Link I/O
interconnect scheme that provides 3GB/s of peak bandwidth.
SB-1
(SiByte): Startup SiByte, founded by former engineers from
Digital Semiconductor, will reveal the first details of its
new superscalar MIPS64-compatible processor core designed
for high-performance communications applications.
PowerPC
7xx (IBM Microelectronics): The newest member of IBM's PowerPC
700 family is a superscalar processor with an FPU and integrated
L2 cache for very high performance.
DVine
SM2700 (Silicon Magic): The SM2700 is the first standard product
based on the DVine (DRAM Vector engine) chip-multiprocessor
architecture. It combines on-chip DRAM with multiple 32-bit
RISC cores and a 16-channel vector processor, all connected
to memory-interface units by multiple 128-bit buses.
TriCore
V1.3 (Infineon): A future TriCore device will use chip multiprocessing
and will be the first implementation of the new Version 1.3
architecture. Features include a high-speed local memory bus,
a coprocessor bus, and enhanced multicore debug support.
IMJAZZ-HW5-09
(Improv Systems): This will be the formal introduction of
a five-processor implementation of Improv's configurable data-path
VLIW architecture. It has multiple VLIW DSP engines, on-chip
SRAM and ROM, and programmable I/O components.
* Low-Power
and High-Integration Embedded Processors (Tuesday, June 13)
A Low-Power
MIPS32 Core (Alchemy Semiconductor): Startup Alchemy, founded
by former StrongARM engineers, will disclose a new MIPS32-compatible
core that runs faster than 500MHz and consumes as little as
200mW.
Crusoe
(Transmeta): Here's a closer look at the innovative LongRun
power-management technology that allows Transmeta's x86-compatible
Crusoe processors to dynamically scale their voltage and clock
frequency to conserve power based on real-time performance
needs. Transmeta will demonstrate LongRun and disclose new
technical details.
TMS320C55x
(Texas Instruments): TI will explain some innovative approaches
to power management that allow the latest 'C55x DSPs to consume
only one-sixth as much power as current 'C54x DSPs while boosting
performance.
aJ-100
(aJile Systems): This is the formal introduction of aJile's
aJ-100 integrated processor, which natively executes Java
bytecodes while achieving real-time response and low power
consumption. The aJ-100 is a multithreaded Java core with
on-chip memory and I/O devices.
Maverick
9213 (Cirrus Logic): This ARM920T-based processor integrates
numerous peripherals and power-management features to provide
an embedded solution for digital-audio applications, such
as MP3 players. Cirrus will disclose previously unrevealed
details about the 9213.
* Embedded
Processor Performance and Profiling (Tuesday, June 13)
The EDN
Embedded Microprocessor Benchmark Consortium (EEMBC) will
announce new benchmark results and explain the essential functions
of its benchmark tests. (Presented by Markus Levy, president
of EEMBC.)
* Cool,
Lame, & Weird Embedded Apps (Tuesday, June 13)
Steve
Leibson, chief embedded analyst for MicroDesign Resources,
will take a humorous look at some of the more unusual applications
for embedded processors.
* Communications
Processors (Wednesday, June 14)
CS2000
(Chameleon Systems): The first public disclosure of a network
processor that contains a 32-bit control processor, fixed-function
peripherals, and a heterogeneous switched fabric of reconfigurable
field-programmable logic elements capable of executing 24
BOPS.
Manta
(BOPS): The first chip based on the ManArray DSP architecture
has a 2x2 array of processing clusters, each of which consists
of four processing elements, each with an integer unit and
FPU. It delivers 24 BOPS and 1.3 GFLOPS.
Monadnock
(Lexra): The first public disclosure of a new RISC processor
core with architectural enhancements for packet processing.
It permits the easy design of chip multiprocessors, allowing
it to accommodate OC-192 data rates.
Fast
Pattern Processor (Agere): The first public disclosure of
a processor that can recognize and classify millions of packets
per second without the need for content-addressable memory
or segmentation-and-reassembly (SAR) devices. The first chip
in this family can process 6 million packets per second, and
future chips will process 50 million packets per second.
* IP
Alternatives for Embedded System Design (Wednesday, June 14)
CPU Plug-Ins
(ARC Cores): The first public disclosure of a microprocessor
core that works with third-party plug-ins. ARC's new technology
will allow developers and IP providers to create customized
instruction sets, register files, and bus configurations for
vertical-market applications.
T1025
(Tensilica): New extensions to the Tensilica Instruction Extension
(TIE) language will allow developers to define new data types
and create associated memory-access, arithmetic, field-manipulation,
and Boolean instructions for Tensilica's configurable processor
core. Tensilica will also disclose the first chips designed
with the enhanced TIE language.
High-Speed
I/O (JAZiO): This startup company will explain its new licensable
I/O technology for embedded-system design.
PowerPC
440GP (IBM Microelectronics): IBM will disclose the first
highly integrated embedded processor based on the PowerPC
440 core announced at last year's Embedded Processor Forum.
The 440GP has a 128-bit CoreConnect bus and 18 integrated
peripherals, including a memory controller, PCI bridge, and
Ethernet controller.
* MEMS:
Advances in Microelectromechanical Silicon for Embedded Design
(Wednesday, June 14)
Roger
Grace, principal of Roger Grace Associates, will deliver a
detailed presentation on an entirely new class of silicon-based
products that provide sensors and actuators for embedded systems.
* DSPs
for Embedded Systems (Wednesday, June 14)
C6401
(Texas Instruments): TI will disclose technical details about
the first DSP based on the TMS320C64x core, which boosts DSP
performance by 10x. The presentation includes new details
about TI's memory subsystem and high-speed peripherals.
Multicore
Architecture for 3G Mobile (Motorola): This will be the first
in-depth look at Motorola's architecture for third-generation
wireless products -- an architecture that combines the StarCore
SC140 DSP with the M-Core 340 microcontroller.
Carmel
2000 (Infineon): The first detailed disclosure of the second-generation
Carmel DSP architecture will include benchmark results documenting
a 2x increase in performance.
* Information
Appliances: Challenges and Opportunities (Wednesday, June
14)
MDR founder
and principal analyst Michael Slater will lead this special
panel discussion with participants from InfoGear, PictureIQ,
Cirrus Logic, S3, and Microsoft.
For more
information about Embedded Processor Forum, visit the Cahners
MicroDesign Resources web site at http://www.MDRonline.com/EPF.
You may also call 800.527.0288 or 408.328.3900 for more information
or to request a brochure.
Patriot
Scientific Allies With ProSyst
Patriot
Scientific has formed an alliance with ProSyst USA to port
the latter's mBedded server software to Patriot's PSC1000
processor family (see Embedded
Processor Watch #44, http://www.MDRonline.com/epw/issues/epw_44.html).
This will allow the bytecode-native PSC1000 to run embedded
Java applications with networking capabilities. ProSyst's
mBedded software is compatible with the wireless application
protocol (WAP), Microsoft's Universal Plug and Play, and Sun's
Jini (see Embedded
Processor Watch #42, http://www.MDRonline.com/epw/issues/epw_42.html).
Patriot and ProSyst are targeting mobile devices such as PDAs,
smart cell phones, Java smartcards, office equipment, and
home appliances. For more information: http://www.ptsc.com
and http://www.prosyst.com.
--T.R.H.
|