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Microprocessor Watch

Issue #107 -- 04/28/2003

Editor: Kevin Krewell

In this issue:


AMD Serves Up Opteron
Kevin Krewell - Senior Editor  {04/28/2003}

The long wait is over. After years of talking about the Hammer architecture and x86-64 (now called AMD64), AMD finally has parts, systems, software, and customers for its 64-bit Opteron processor. AMD’s new processor uses its latest 130nm silicon on insulator (SOI) process for lower power. The 1.4GHz to 1.8GHz clock speeds may not impress the 32-bit PC processor crowd, but Opteron takes the top-clock-speed award for 64-bit server processors.

AMD’s Opteron launch is the first wave of AMD64 processors. The desktop and mobile Athlon 64 processors are still scheduled for September. In the meantime, AMD plans to push the Barton processor for desktop and mobile uses.

AMD announced availability of the Opteron Series 200 processors at the April 22 launch. The Opteron Series 200 Model 240 (1.4GHz), 242 (1.6GHz), and 244 (1.8GHz) are available now. Opteron processor model numbers 840, 842, and 844 are scheduled to be available in 2Q03; series 100 Opterons are slated for 3Q03.

List price for Opteron model 240 is $283 in 1,000-unit quantities; the model 242 is $690, and the model 244 is $794.

Microprocessor Report readers can access the full story here: www.mdronline.com/mpr/h/2003/0428/171701.html. To find out more about Microprocessor Report, please visit: www.mdronline.com.

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Big Iron for the Desktop
Peter Glaskowsky - Editor-in-Chief  {04/28/2003}

I joined MDR seven years ago to cover PC platform technology, an area that has experienced tremendous progress over the years. In just the past three years, we’ve seen front-side bus speeds—a critical constraint for processor performance—soar from the 133MHz of Intel’s Pentium III to the 800MHz of the new Pentium 4. That’s a 6:1 improvement, better than Moore’s Law would predict. Memory bandwidth has increased comparably, with single banks of 133MHz SDRAM giving way to the dual banks of DDR400 SDRAM in today’s best desktop PCs.

Software development used to lead hardware development: each new version of Windows and each new major application, such as DVD playback, used to arrive before PCs were fast enough to take full advantage of them. Today, the situation is reversed. Even low-cost PCs are more than fast enough for the software they’re likely to run. Only in a few niche markets, such as 3D games, are PCs strained to their limits.

Peripherals have also lagged behind. The ATA hard-disk interface is just twice as fast today than it was three years ago. The hard disks themselves are improving at a similar rate, but they continue to be a limiting factor for many kinds of software. The 100Mb/s Fast Ethernet standard still accounts for almost all local-area networks; Gigabit Ethernet has been slow to catch on.

During the next year, we’ll see several new technologies arrive on our desktops that will help break these performance logjams and open the market to new applications. The Serial ATA standard, for example, will support a 150MB/s transfer rate, and this rate will double again within two years. Serial ATA will make it easier for end users to add another drive to their systems, and, with disk-array technology, such an upgrade can boost performance as well as capacity.

PCI Express will remove another obstacle to end-user system expansion by providing more than enough bandwidth for tomorrow’s high-performance peripherals. The familiar PCI bus isn’t even fast enough for many of today’s needs, so PCI Express is long overdue.

I/O coprocessing isn’t a new technology, but it’s one we’re likely to see more of in mainstream systems. Graphics cards are coprocessors already, doing tasks that were once the responsibility of the CPU. I believe networking will be the next major role for coprocessors in the PC. Running the TCP/IP stack for a Gigabit Ethernet link can consume the equivalent of a 2GHz processor—or a $20 ASIC. That’s a pretty easy choice to make. On the other hand, high-definition video processing is only a temporary market for coprocessors. The HDTV standard will be with us for many years, and CPUs will soon be fast enough to handle HDTV for most users.

The transition to 64-bit desktops, however it takes place, will impose new requirements on the PC platform. With 4G of DRAM available at retail for less than $500, and with further price cuts inevitable, we need to have PC motherboards with more memory slots than the two or three that have become commonplace—at least at the high end of the market. Similarly, now that multithreaded operating systems and applications are commonplace, we should see a return to dual-processor configurations for high-end desktops.

PC buyers have always responded well to technology transitions that promise dramatic improvements in system capabilities, and software developers have always come through with new ways to take advantage of these capabilities. Today’s PCs are more than a match for yesterday’s supercomputers. What will tomorrow’s PCs be like?

To find out more about Microprocessor Report, please visit: www.mdronline.com.

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Sun Weaves Multithreaded Future
Kevin Krewell - Senior Editor  {04/14/2003}

At the Sun Worldwide Analyst Conference, the company revealed plans to take its UltraSPARC processor family in a direction heavily dependent on multicore and multithreaded microarchitectures. Sun hopes its new direction will lead to a blade processor up to 15 times faster than Sun’s present blade server processor and a SPARC system processor 30 times faster than today’s big iron server processors; a traditional single-threaded processor might expect to triple its performance during the same time frame.

Sun’s first multicore SPARC will be the UltraSPARC IV, which integrates two US III cores on one die. It is pin compatible with the US III socket to simplify system upgrades, but it still offers memory subsystem improvements and improved reliability, accessibility, and serviceability (RAS) features.

The next new processor core will be the UltraSPARC V in 2005. The US V will support two threads, visual instruction set (VIS) 3.0 multimedia extensions, additional RAS features, and what Sun terms “aggressive performance enhancements.”

In 2005, Sun also plans to introduce a blade processor that it promises will offer 15 times the throughput of the 650MHz UltraSPARC IIi—an audacious goal. The processor is code-named Niagara, and it integrates eight UltraSPARC II cores per die; each core can support four threads.

Sun’s new roadmap represents a huge challenge for the company, but it has thrown caution to the winds and is making significant processor promises for the next three years.

Microprocessor Report readers can access the full story here: www.mdronline.com/mpr/h/2003/0414/171501.html. To find out more about Microprocessor Report, please visit: www.mdronline.com.

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Intel and VIA Make Peace, Not Lawsuits
Kevin Krewell - Senior Editor  {04/14/2003}

On April 8, 2003, Intel and VIA Technology suddenly announced settlement of all outstanding legal actions between the two companies and signed a 10-year patent cross-license agreement, ending an acrimonious series of legal battles. The comprehensive agreement settles 11 pending cases in five countries involving 27 patents. As part of the announcement, VIA will be able to produce Intel-compatible x86 processors and chip sets for a specified period. VIA agreed to pay Intel unspecified royalties on some of its products.

As part of the agreement, Intel granted VIA a license to sell microprocessors that are x86 compatible. In a move reminiscent of the AMD-Intel agreement from 1995, VIA relinquished future rights to produce microprocessors with an Intel-compatible bus. VIA does have a three-year period during which it can produce processors with an Intel-compatible bus. After the three-year grace period, VIA must become fully independent.

Intel gave VIA a four-year period to design and manufacture chip sets compatible with Intel microprocessors and an additional year for sales and OEM sales of Intel-compatible chip sets. After that period, VIA would presumably be out of the Intel-compatible chip-set business.

Microprocessor Report readers can access the full story here: www.mdronline.com/mpr/h/2003/0414/171504.html. To find out more about Microprocessor Report, please visit: www.mdronline.com.

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AMD Launches Mobile Blitz
Kevin Krewell - Senior Editor  {04/07/2003}

AMD recently launched a barrage of notebook processors, just as Intel released its Centrino platform and the Pentium M processor. The new processors include a significant change for AMD, as it has released low-voltage versions of the Athlon XP-M processor with a 25W-maximum power envelope designed to fit into thin-and-light notebooks. AMD finally has a part it can sell into the more-stylish notebooks and notebooks for corporate use. AMD also has an 802.11 wireless data chip set but does not bundle it in the same manner that Intel does with the Centrino branding program. AMD does not offer its own mobile chip set, relying on third-party solutions from ATI, SiS, and VIA.

Microprocessor Report readers can access the full story here: www.mdronline.com/mpr/h/2003/0407/171403.html. To find out more about Microprocessor Report, please visit: www.mdronline.com.

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